The low dielectric constant hyperbranched polycarbosilane derived resins with spacing groups

Abstract

AbstractThe route via the cross‐linking of hyperbranched prepolymers has potential advantage to construct low dielectric constant (low‐k) resins owing to the enhanced molecular free volume in hyperbranched structure. However, it is still a challenge to prepare hyperbranched resins with good film‐forming property and low‐k. In this paper, two hyperbranched polycarbosilanes with reactive benzocyclobutene groups were synthesized via hydrosilylation reaction to avoid the generation of SiO bonds for enabling the low polarity of chemical bonds. The spacing groups including phenyl or ethylene were incorporated into the hyperbranched structures, and the effect of the spacing groups on the physicochemical properties of hyperbranched polycarbosilane derived resins were investigated. The phenyl groups were found to effectively decrease the dielectric constant (k), while endowing the resins with good film forming ability and thermostability. The UV/thermally cured phenyl group resin owing to dual crosslinked structure, the patterns would not be deformed significantly during thermally cured process. Both hyperbranched polycarbosilane derived resins could be potential photoresists.