Abstract
In 2032–2034, the LHCb will be upgraded to efficiently explore the new HL-LHC conditions. The increased number of interactions per event and radiation level brings several challenges including high non-uniform radiation doses (up to 6×1016MeVneq/cm2), operation under vacuum (power dissipation below 1.5 W/cm2), high data rates (up to order of 100 Gbps/ASIC) and ASIC timing resolution (30 ps or better). This proceedings describes the requirements for two different upgrade scenarios (different pixel pitch, radiation doses and material budget while keeping the same scattering terms), application specific integrated circuit status to readout the sensor pixels (PicoPix and IGNITE), electronic integration (Anisotropic Conductive Bonding) and data transmission (FALAPHEL). In summary, the open challenges mentioned before are being addressed in the current R&D phase and the most suitable candidate solutions will be consolidated in the technical design report in the coming years.
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