Abstract
In an earlier paper the diffusion equation associated with grain boundary grooving was solved and it was concluded that surface diffusion was the dominant transport mechanism for copper. For this mechanism the theory predicts that the shape of the groove profile has a time independent form and that the groove width and depth increase linearly with t 1 4 . These two predictions have been tested by studying the grooving of tilt boundaries in copper annealed in dry hydrogen at 930°C and 1035°C. Both predictions agree with the experimental results. The validity of the theory allows one to calculate the surface diffusion coefficient, D s . The advantages of this method of determining D s are discussed.
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