Abstract
In the space station, filamentous fungi are one of the main potential hazards causing short circuits or corrosion failure of printed circuit boards (PCBs). A 90-day fungal corrosion test was carried out on the China Space Station (CSS), focusing on the interaction between A. brasiliensis and exposed copper circuits. The results showed that the mycelial morphology, ultrastructure, and organic acid accumulation of the test fungi exhibited significant changes in the space microgravity environment. Aspergillus brasiliensis tended to excrete higher levels of oxalic acid in space as a defense mechanism against copper toxicity, which could exacerbate localized corrosion of copper metal.
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