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Abstract
The corrosion of wrought, electrodeposited, and cold spray deposited copper was electrochemically monitored for ∼160 days in 3 M NaCl solution containing traces of sulfide under anoxic and Ar-purged conditions. Corroded specimens were analyzed using scanning electron microscopy and Raman and X-ray photoelectron/Auger spectroscopies. Under anoxic conditions, corrosion was supported by sulfide only and the rate decreased with time causing only minor damage. Under low oxygen conditions maintained by Ar-purging, the rate increased with time and significant damage was observed, attributed to oxy-sulfur species formation. These results suggest that oxy-sulfur species, not just sulfide, are required to cause intergranular corrosion.
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