Abstract
Hydrogenized carbon films 0.5–7.0 μm thick doped with silicon (11.9 ± 0.4 at %) and oxygen (1.7 ± 0.1 at %) have been grown on VT-6 titanium and silicon substrates in an externally heated arc discharge plasma. The hardness, internal stresses, surface morphology, wettability, and surface potential of the films against their thickness have been studied. It has been found that as the film gets thicker, the allowable load on the material and its hardness grow. It has been shown that the films have low internal stresses (below 600 MPa) and the water contact angle is 75°–80°. It have turned out that an increase in film thickness raises the negative surface potential from 50 to 670 mV.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.