Abstract
The structure and microhardness of Cu-0.3 at. % Mo vacuum condensates obtained at different deposition rates, both in the initial state and after isothermal annealings carried out up to 800 °C, were studied in the work. It has been established that molybdenum has a dispersing effect on the grain structure of the copper matrix, which consists of the blocking effect of monoatomic molybdenum adsorption layers formed on the surface of growing copper grains during the condensation of a two-component vapor. The structure of Cu-0.3 at. % Mo condensates demonstrates increased thermal stability, retaining the size of the original grain upon annealing up to 800 °C. The thermal stabilization of the grain structure of condensates is explained by the influence of grain-boundary segregations of molybdenum atoms and particles, which reduce the free energy of grain boundaries and the rate of their migration.
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