Abstract
In this study, carbide-forming metallic additives (W, Mo, Cr, Ti) were introduced into the copper matrix to improve the wettability of diamond particles in the copper–diamond composites. The samples were prepared by Spark Plasma Sintering (SPS) and Hot Pressing (HP) at 920 °C. The phase composition, microstructure and thermal conductivity of the samples were investigated. The influence of the carbide-forming additive concentration, the sintering method as well as the nature of the metal introduced into the copper matrix on the thermal conductivity of copper–diamond composites was determined. Titanium ensured a more significant wettability improvement at the copper–diamond interface. This is due to its higher solubility in copper in comparison with other metals (W, Mo, Cr) and the possibility of its diffusion through the copper matrix to the diamond surface resulting in the formation of a closer contact at the copper–diamond interface.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
