Abstract
AbstractThe influence of the bumping height on the performance of flip‐chipped CPW Lange couplers is investigated. The coupler design method is done by measurements of a coupler integrated in a multilayer thin‐film MCM‐D. The reasons for the detuning are identified, and solutions to easily predistort the design or reduce the detuning effect are given. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 29: 263–267, 2001.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
