The influence of surface removal on the Bauschinger effect

Abstract

Surface removal was found to reduce the Bauschinger effect (BE) in copper single crystals. The experimentally determined average reduction was 55% for the Bauschinger strain factor and 27% for the Bauschinger stress factor after 250 μm had been removed from the radius by in situ etching. An attempt was made to explain this surface effect on BE with simple dislocation models. Dislocation surface source operation formed the basis of the computer simulation models for BE. One of the models developed successfully predicted a reduction in the Bauschinger strain factor of 55% and in the Bauschinger stress factor of 29%.