Abstract

The influence of stacking fault energy on microvoid coalescence in “pure” materials has been studied. It was shown that as a material's stacking fault energy (SFE) decreased, the extent of microvoid coalescence that occurred during ductile fracture also decreased. The decrease of microvoid coalescence in low SFE materials was attributed to a hindrance in the development of dislocation cells associated with the restricted motion of dislocations. In “pure” materials, microvoids are believed to initiate and grow along dislocation cell walls formed during deformation. As such, the absence or scarcity of cells in lower SFE materials limits the formation of these voids during ductile fracture.

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