Abstract

Adhesion plays an important role in microelectromechanical systems (MEMS). It is a major concern in MEMS reliability and oftentimes excessive adhesion forces lead to permanent adherence of MEMS surfaces resulting in microdevice failure. The role of residual stresses in the adhesive contact between a pre-stressed membrane and a rigid flat-ended cylindrical punch is studied. Breaking the contact can be achieved under either fixed-load or fixed-grips configuration. The influence of the residual stress on the pull-off force, punch displacement, and contact area at pull-off is studied. It is shown that residual stresses have significant influence on interfacial contact behavior in MEMS and, hence, should be taken into consideration in formulating the adhesion contact mechanics.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.