The influence of particleboard resination on their internal bond strength

Abstract

The influence of particleboard resination on their internal bond strength. The aim of the project was to investigate the main mechanical and physical properties of particleboards, especially focused on internal bond, in terms of their resination. For the tests, the particleboards have been produced in laboratory conditions with the following glue content: 7, 10, 15, 30 and 50%. Particular attention was paid for examining the mechanical property – tensile strength perpendicular to surfaces (Internal Bond – IB). In addition, there were investigated modulus of elasticity (MOE), modulus of rupture (MOR) density and density profile. In the light of above mentioned tests, there is no positive effect of improvement of tested parameters when raise resination over 30% when producing particleboards. With the resination increase from 7 to 50% a significant change (densification) of panels’ structure, as well as differences between face and core layers density have been found.