Abstract
Constrained sintering of a substrate with a sandwich structure, which was the laminated inner-constraining alumina layer between the glass-alumina mixed layers, has been studied. The influence of specific surface area of the particles and porosity of inner constraining particle layer upon sintering shrinkage was investigated. Specific surface area of the alumina powder for the inner constraining particle layer could be changed by grinding and blending two different particle size powders. As for the debinded sheet used with ground alumina powder, the pore distribution was sharp, and the bending strength was proportional to the specific surface area. In the case of inner constraining particle layer used with ground alumina powder, penetration length of molten glass from glass-alumina mixed layers obeyed Kozeney-Carman’s equation. On the other hand, as for the debinded sheet with particle size blended powder, the effects of specific surface area on the bending strength and the penetration length of molten glass differed from the results of the grounded one. Sintering shrinkage in X-Y direction of the sandwich substrate was basically related to the bending strength of debinded alumina powder sheet for inner constraining particle layer in both cases.† This report was originally printed in J. Soc. Powder Technology, Japan, 41, 730-737 (2004) in Japanese, before being translated into English by KONA Editorial Committee with the permission of the editorial committee of the Soc. Powder Technology, Japan.
Highlights
Electronic equipment has become ever smaller, reflecting the growing demand for more compact, lower-profile electronic components and higher density electronic component packaging applications.In the field of ceramic multi-layer substrates, a method for manufacturing LTCC (Low TemperatureCo-fired Ceramics) substrates, whereby silver or copper electrode materials of relatively low electric* 2-26-10, Tenjin, Nagaokakyo-shi, Kyoto 617-8555Corresponding authorMaterials Research & Development Center, 2288Ohshinohara, Yasu-shi, Shiga 520-2393TEL: +81-77-586-8325 †This report was originally printed in J
The relation between the bending strength and shrinkage in horizontal directions of the substrate can be plotted on the same curve, regardless of whether the constrained layer is made from ground alumina or size blended alumina particles
2) When the constrained layer is made from ground alumina particles and assuming the porosity of the particle layer remains constant, the bending strength is proportional to the specific surface area
Summary
Electronic equipment has become ever smaller, reflecting the growing demand for more compact, lower-profile electronic components and higher density electronic component packaging applications.In the field of ceramic multi-layer substrates, a method for manufacturing LTCC (Low TemperatureCo-fired Ceramics) substrates, whereby silver or copper electrode materials of relatively low electric* 2-26-10, Tenjin, Nagaokakyo-shi, Kyoto 617-8555Corresponding authorMaterials Research & Development Center, 2288Ohshinohara, Yasu-shi, Shiga 520-2393TEL: +81-77-586-8325 †This report was originally printed in J. Electronic equipment has become ever smaller, reflecting the growing demand for more compact, lower-profile electronic components and higher density electronic component packaging applications. In the field of ceramic multi-layer substrates, a method for manufacturing LTCC Co-fired Ceramics) substrates, whereby silver or copper electrode materials of relatively low electric. This report was originally printed in J. Soc. Powder Technology, Japan, 41, 730-737 (2004) in Japanese, before being translated into English by KONA Editorial Committee with the permission of the editorial committee of the
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