The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of In<italic>x</italic>Ga1–<italic>x</italic>As nTFETs

Abstract

The basic analog parameters of three splits of In x Ga1– x As nTFETs are analyzed for the first time. The first two splits are In0.53Ga0.47As devices with a 3-nm HfO2/1-nm Al2O3 and a 2-nm HfO2/1-nm Al2O3, while the last one is an In0.7Ga0.3As channel with a 3-nm HfO2/1-nm Al2O3 gate. The low equivalent oxide thickness improves the electrostatic coupling, enhancing ${I}_{{\text {DS}}}$ , and, consequently, also gm and ${A}_{V}$ , especially for higher $\text {V}_{{\text {GS}}}$ . The InGaAs tunnel field-effect transistors (TFETs) show compatible performance with Si TFETs, and have better performance than Si MOSFETs, making them useful for low-power and low-voltage analog applications. The highest efficiency is found using the combination of a 2-nm HfO2 with In0.53Ga0.47As, due to the 56-mV/dec subthreshold swing obtained. For all splits, the ${A}_{V}$ peak can be related to the ${V}_{{\text {GS}}}$ necessary for band-to-band tunneling to become the dominant transport mechanism.