Abstract
We describe the laser-induced chemical liquid phase deposition of copper using a solution containing a non-ionic surfactant on substrates comprising either an oxide glass or a glass-ceramic Sitall. Our results demonstrate that the addition of the surfactant to the deposition solution results in improved structural topology in the deposited copper layer. Our data confirm that the use of a non-ionic surfactant can reduce the negative influence of gas formation during the deposition process.
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