Abstract
The electrochemical behaviour of copper–nickel alloys with different Ni content (5–65%) in sulphate solutions of pH 12 was investigated. The effects of temperature, immersion time, and concentration of sulphate ions were also studied. Different electrochemical methods such as open-circuit potential measurements, polarization techniques and electrochemical impedance spectroscopy (EIS) were used. Potentiodynamic measurements reveal that the increase in nickel content increases the corrosion rate of the alloy in sulphate solution linearly. Nevertheless, an increase in the nickel content along with increase in immersion time improves the stability of the Cu–Ni alloys due to the formation of a stable passive film. An equivalent circuit model for the electrode/electrolyte interface under different conditions was proposed. The experimental impedance data were fitted to theoretical data according to the proposed model. The relevance of the model to the corrosion/passivation phenomena occurring at the electrode/solution interface was discussed.
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