Abstract
The influence of maleic acid on the electroless deposition of Co–P was investigated. The changes of the stationary potential, the deposition rates and the plating efficiencies with the concentration of the additive were determined. The correlation with the Tafel-like equation was found. The dependence of the morphology of the as-plated deposits on the additive concentration was observed. The effect of succinic acid (at only one concentration) was also analyzed.
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