Abstract
The influence of dwell time on mechanical behaviour and fatigue life of SMT solder joints under thermal cycling has been investigated. The dwell time has two effects on the mechanical behaviour of SMT solder joints under thermal cycling: first, in the dwell time of high-temperature part, the stress in SMT solder joints will notably relax, and secondly, as the dwell time increase, the stress in solder joints in the low-temperature part of thermal cycling increases. With the increase of dwell time, the life of SMT solder joints under thermal cycling exponentially decreases.
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