Abstract
The influence of the cooling efficiency of the sputtering cathode on the nanostructure of an aluminum based (Al-based) thin film sputterdeposited on a large glass substrate (550 × 650 mm) was investigated, With high cooling efficiency, a highly (111)-textured pure-Al film was formed. On the other hand, low cooling efficiency contribute to the formation of a three-layer structure Al-Cu thin film that showed strong resistance to hillock and whisker generation.
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