The influence of boundary conditions on thermal conductance in semiconductor quantum wire with structural defect

Abstract

Using the scattering-matrix method, we investigate the influences of boundary conditions on thermal conductance in quantum wire with structural defect. A comparison between the thermal conductances is made when stress-free, hard-wall, and mixed boundary conditions are applied for acoustic transport leads. The results show that the quantized thermal conductance plateau at very low temperature can be observed only in transport lead with stress-free boundary condition. For hard-wall or mixed boundary conditions, qualitatively different thermal conductance characteristics are found. Moreover, we find that the behavior of the thermal conductance sensitively depend on the geometric parameters and the position of the defect in quantum wire.