Abstract
We have focused on shape-memory properties of Cu-Sn based ternary alloys in this study. We have attempted to suppress degradation at room temperature aging and to improve the amount of shape recovery by adding the third element to a binary Cu-Sn alloy. The attempt has successfully conducted in Cu-Sn-Mn alloy, the degradation due to aging at room temperature was suppressed and the thermal stability was improved. Furthermore, the present study revealed that Cu-Sn-Mn alloy exhibited a large super elastic recovery in three point bending tests. We have also investigated the shape-memory properties of Cu-Sn-Si alloys and revealed that the ternary alloy has achieved super-elastic recovery better than the Cu-Sn-Mn alloy in the three-point bending tests.
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