The implementation and performance evaluation of a silicon-based LED packaging module with lens configuration

Abstract

This study develops a transfer molding with flexible master for a silicon-based light emitting diode packaging with an aspherical lens and a microlens array using microelectromechanical systems technology. By transferring the pattern from wafer to wafer, the precise alignment of the lens configuration and the reflector of the silicon substrate can be achieved; batch processing can be used to reduce the costs. The size of the packaging element can be further reduced to allow more applications. For evaluating the packaging performance, the transfer of the pattern of various lens profiles is accomplished successfully using silicone gel and electroplating nickel as the lens molds, and experiments to determine the mechanical reliability are conducted. The experimental results show that the lens profiles of the silicone gel and nickel masters are exactly transferred onto the surfaces of epoxy and silicone gel encapsulations, respectively, without any damage to the material surface. The brightness of the packaging elements with a single aspherical lens profile and high fill factor microlens array are increased by 26 and 16 %, respectively, as compared with optical encapsulation with a smooth curved surface. The light uniformity is greatly improved for a 100 % fill factor microlens array. The proposed packaging solution satisfies the requirements of pattern transfer in a wafer level and improves lighting performance.