Abstract
This note assesses the impact of the quality of the bonding layer on the sensingcapability of plane piezoelectric patches. The bonding layer between thepiezoelectric material and the main structure is assumed to be elastic, having afinite stiffness and considerable thickness as compared to the thickness of thepiezoelectric sensor. The equations governing the mechanical equilibrium aresimplified by assuming a pure shear stress state in the bonding film. Theequilibrium equations are derived, the associated functional is obtained and,subsequently, the finite-element method is employed to solve the problemin two dimensions. The displacements found are those occurring on thecontact surface between the bonding film and the piezoelectric sensor.The numerical solution obtained in terms of displacements allows thecalculation of the effective voltage ‘observed’ by the piezoelectric sensor. Thisinvestigation addresses shear lag effects and shows that end-bonding must becarefully assessed in order to enhance the quality of the sensing output.
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