Abstract

We demonstrate that modeling bulk traps and passivation/barrier interface traps in AlGaN/GaN HEMT is necessary to reproduce experimentally observed device behavior. Comparative modeling analysis of different leakage mechanisms in vertical p-n diode with a threading dislocation shows that variable range hopping is the dominant leakage mechanism there. The 3D quantum transport analysis of the impact of threading dislocations on electron mobility for sheet-like and nanowire-like GaN and Si MOSFET channels suggests considerable nanosheet variability and super-sensitive nanowire response. The analysis of voids in electrochemically induced pitting characterizes the impact of different pit types on different key metrics of transistor performance.

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