Abstract
This work aims to study the impact of nanofluids with alumina particles on pool boiling performance. Unlike most studies, which use a trial-and-error approach to improve boiling performance parameters, this study details the possible effects of nanoparticles on the effective mechanisms of boiling and heat transfer. For this purpose, biphilic surfaces (hydrophilic surfaces with superhydrophobic spots) were used, which allow the individual analysis of bubbles. Surfaces with different configurations of superhydrophobic regions were used. The thermophysical properties of fluids only vary slightly with increasing nanoparticle concentration. The evolution of the dissipated heat flux and temperature profiles for a nucleation time frame is independent of the fluid and imposed heat flux. It can be concluded that the optimal concentration of nanoparticles is 3 wt%. Using this nanoparticle concentration leads to lower surface temperature values than those obtained with water, the reference fluid. This is due to the changes in the balance of forces in the triple line, induced by increased wettability as a consequence of the deposited particles. Wherefore, smaller and more frequent bubbles are formed, resulting in higher heat transfer coefficients. This effect, although relevant, is still of minor importance when compared to that of the use of biphilic surfaces.
Highlights
The present paper addresses a critical perspective on the use of alumina nanofluids in pool boiling performance for cooling applications
The first subsection will discuss the alumina nanofluid properties and how they are affected by the concentration of the nanoparticles
The second section discusses the overall effect of the nanofluids on the pool boiling performance
Summary
Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. Technological development observed in the last decades has led to the constant search for new, improved, and more efficient mechanisms in many high technology industries, such as electronics, communication, and manufacturing. Increasing server rack density and chip density, new use cases such as harsh edge computing environments, and pressure to reduce energy consumption during data center cooling are expected to drive the cooling market [1]. The higher performance of the devised equipment raises the need for innovative cooling systems capable of dissipating the high heat fluxes associated. The cooling market is projected to grow from USD 243 million in 2021 to USD 700 million by 2026, at a CAGR of 23.6% from 2021 to 2026 [2]
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