The Imaging of Fine Lines‐Conventional Technology or Laser Direct Imaging?

Abstract

The continuing trend towards miniaturisation is constantly driving the printed circuit manufacturer to seek new or improved methods of imaging the circuit pattern onto base laminates. Significant advances have recently been made in conventional dry film technology to meet the needs for fine‐line applications. However, a new technology—Laser Direct Imaging of the dry film—is also emerging as a viable alternative. This paper will examine the state‐of‐the‐art of both conventional dry film technology and laser direct imaging of a photoresist for production of the next generation of high density printed circuit boards.