Abstract
The micro-electromechanical system (MEMS) safety-and-arming (S&A) device has the features of integration and miniaturization, which is one of the important directions of weapon development. Confined by the fabrication process, the silicon-based devices are too fragile, and the metal-based devices are low precision. In order to solve the contradiction between high precision and high structure strength, a metal/silicon composite structure is proposed in this paper, and a hybrid fabrication process is introduced. This new method mainly consists of metal sputtering, electroplating, and (inductively–coupled-plasma) ICP etching. As the resolution of the thick dry film is limited, the process of a femtosecond laser is applied to refine the structure, and the Ni plate (a block of 1 mm × 3 mm × 0.3 mm with a cavity of ϕ 0.85 mm × 0.3 mm in the center) is fabricated on the silicon-on-insulator (SOI) wafer successfully. After the double sides are etched by ICP, the SOI wafer is immersed in a buffered-oxide-etch (BOE) etchant to remove the buried layer. The cover plate acts as the encapsulation and is bonded with the SOI wafer by the epoxy glue. Then, the temporary support beam of the device is broken by the probe, and the suspended composite structure can be fully released. The hybrid process is the integration of the silicon-based process and the metal-based process, which can combine the advantages of both high precision and a high structure strength. The process proposed here is suitable for the application of weapon miniaturization.
Highlights
Safety-and-arming (S&A) devices are one of the core components in munitions, and are mainly applied in the micro initiator
In order to solve the contradiction above, we present a micro-electromechanical system (MEMS) S&A device with a hybrid structure, which can combine the advantages of the metal device and silicon device together
The device fabricated by the hybrid process can have features such as a minimized size, high precision, and high structure strength, which is conducive to the development of weapon miniaturization
Summary
Safety-and-arming (S&A) devices are one of the core components in munitions, and are mainly applied in the micro initiator. Ni is commonly used in the metal-based device The micro structures, such as sliders, springs, and latches, are fabricated by lithographie-galvanoformung-abformung (LIGA) separately, and are assembled together. Helene Pezous et al [1] have found a special way to combine the advantage of a metal material and silicon material In their work, they have separated the device into the logic control part and the barrier part. The logic control part is fabricated on a silicon wafer, and the barrier part is based on aluminum These two parts are glued together to achieve the device assembly. The device fabricated by the hybrid process can have features such as a minimized size, high precision, and high structure strength, which is conducive to the development of weapon miniaturization
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