The high temperature–high pressure sintering of diamond–Cu–Si–B composite

Abstract

Such elements like Si, B and Cu have been utilized as components of binder aiming at acquiring high adhesion of the binder with the diamond grains, thermal stability of the composite and, relatively low fusion temperature of the binder. The present work has as its main objective the study of the interaction between components during sintering of polycrystalline diamonds with addition of binders under high pressures, in the range from 5.0 to 6.0 GPa and high temperatures, in the range from 1473 to 1773 K with process time between 15 and 30 s. After sintering the compacts were subjected to investigations concerning the influence of the mixture composition and of the process parameters on the density and wear resistance of the compacts. The method of factorial planning was utilized in order to obtain model which describes influence of sintering parameters on the properties of compacts.