The growth of interfacial compounds between titanium dioxide and bismuth oxide

Abstract

The growth of interfacial compounds between TiO 2 and Bi 2O 3 during transient liquid phase bonding at 900, 1000 and 1100 °C for various times was investigated. The microstructures and compositions of compounds in joints were analyzed by means of SEM and EPMA. It was found that the compound Bi 4Ti 3O 12 forms initially and replaces the Bi 2O 3 interlayer. Bi 2Ti 4O 11 then arises at the interface between Bi 4Ti 3O 12 and TiO 2 and the metastable Bi 2Ti 2O 7 phase appears last at the interface between Bi 4Ti 3O 12 and Bi 2Ti 4O 11. The modes and activation energies of the growth of Bi 4Ti 3O 12 and Bi 2Ti 4O 11 were determined respectively. Holes in the middle of the joint heated at 1100 °C for 24 h were also found.