Abstract

AbstractThe evolution of the surface topography of thin amorphous Cu-Ti films during the film growth is investigated by scanning tunneling microscopy. The films begin to grow with smooth surfaces until the film thickness reaches a critical value. Then, within a small thickness interval, a grainy microstructure of the film develops which looks very similar to the microstructure of polycrystalline films. Measurements of the intrinsic macroscopic stress in these films during the film growth show compressive stresses in the early growth stages. Then a change to tensile stresses accompanies the change in the surface topography within the same thickness interval. Both, the surface topography and the intrinsic stresses, are always correlated and depend on the deposition temperature and on the film composition. We discuss implications of these observations on the origin of macroscopic intrinsic tensile stresses in amorphous transition metal films.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call