Abstract
The bonding performances of the composite joint that made of microporous copper and Sn were investigated in this paper. It could rapidly generate .The Cu3Sn- microporous copper composite joint with a thickness of 100 μm was successfully obtained after bonding at 360 °C for 5 min under a low pressure of 0.6 MPa.The shear strength of the composite joint reached 166.05 MPa, which was 2.5 times higher than that of full Cu3Sn joint. The fracture mechanism of composite joint was analyzed by fracture morphology.A large amount of copper could be observed in the fractured surface of composite joint.The self-locking structure was generated between the Cu3Sn and microporous copper in the composite joint.The microporous copper provided more nucleation particles during the formation of Cu3Sn and finally resulted in the refinement of the Cu3Sn grains. In addition,the occurrence of fracture was delayed due to the plastic deformation of microporous copper.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
