Abstract
The subject of silicon microsystems is reviewed from a device manufacturing viewpoint. Techniques taken straight from the integrated-circuit industry were the starting point for this work. Because of the 3D nature of microsystems, different processes have been developed to fully exploit the potential of this field, particularly in substrate etching and lithography. The paper explores the developments that have been made in this area, and how it is likely that microelectronics and microsystems, from a manufacturing point of view, will diverge even further in the future.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
