Abstract
Aluminum nitride (AlN) is the promising substrates material for the epitaxial growth of III-nitrides devices, such as high-power, high-frequency electronic, deep ultraviolet optoelectronics and acoustic devices. However, it is rather difficult to obtain the high quality and crack-free thick AlN wafers because of the low surface migration of Al adatoms and the large thermal and lattice mismatches between the foreign substrates and AlN. In this work, the fabrication of AlN material by hydride vapor phase epitaxy (HVPE) was summarized and discussed. At last, the outlook of the production of AlN by HVPE was prospected.
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