The evolution of the grain boundary ensemble of polycrystalline nickel under creep at elevated temperatures

Abstract

The evolution of the grain boundary ensemble of polycrystalline nickel under creep at 823 K (~0.5 Тm) has been investigated by the electron backscattered diffraction technique. At low strains, delamination of twin grain boundaries Σ3 is found to take place, giving rise to coincidence site lattice grain boundaries Σ9 and Σ27. Low-angle misorientations in the material are shown to increase considerably with increase in the degree of strain, which causes a decrease in the fraction of the coincidence site lattice grain boundaries due to interaction with lattice dislocations.