The evolution of preferred orientation and morphology of AlN films under various sputtering parameters

Abstract

Wurtzite aluminum nitride (AlN) films with (100) and (002) preferred orientations are obtained on Si (100) wafers by radio frequency magnetron sputtering. The effects of target to substrate distance (TSD), RF power, deposition pressure and substrate temperature on crystal orientation and morphology of AlN films are analyzed. It is demonstrated that the TSD is the key factor affecting the preferred orientation of AlN films. The preferred orientation transforms from (002) to (100) with the increase of TSD. Further increase of substrate temperature and RF power causes the coexistence of (002) and (100) orientation. The evolution of orientation is explained by the change in kinetic energy of sputtered particles. The correlation between the crystal orientation and the surface morphology is investigated.