Abstract
The physical properties of the machining-induced new surface depend on the performance of the initial defect surface and deformed layer in the subsurface of the bulk material. In this paper, three-dimensional molecular dynamics simulations of nanoindentation are preformed on the single-point diamond turning surface of single-crystal copper comparing with that of pristine single-crystal face-centered cubic copper. The simulation results indicate that the nucleation of dislocations in the nanoindentation test on the machining-induced surface and pristine single-crystal copper is different. The dislocation embryos are gradually developed from the sites of homogeneous random nucleation around the indenter in the pristine single-crystal specimen, while the dislocation embryos derived from the vacancy-related defects are distributed in the damage layer of the subsurface beneath the machining-induced surface. The results show that the hardness of the machining-induced surface is softer than that of pristine single-crystal copper. Then, the nanocutting simulations are performed along different crystal orientations on the same crystal surface. It is shown that the crystal orientation directly influences the dislocation formation and distribution of the machining-induced surface. The crystal orientation of nanocutting is further verified to affect both residual defect generations and their propagation directions which are important in assessing the change of mechanical properties, such as hardness and Young's modulus, after nanocutting process.
Highlights
Ultraprecision machining at nanometric scale is increasingly required in micromachining and nanomachining to produce parts of intricate features and surface finish quality [1]
Description of interior defects in nanocutting Before investigating the machining-induced surface mechanical properties by nanoindentation, we present a general description of the phenomenon observed on and beneath the machining-induced surface Cu (010) in the simulations of nanocutting process
The present investigation has shown how the machininginduced surface affects the mechanical properties in the atomic level of single-crystal copper by molecular dynamics simulation
Summary
Ultraprecision machining at nanometric scale is increasingly required in micromachining and nanomachining to produce parts of intricate features and surface finish quality [1]. Material removal at such a small uncut chip thickness involves subsurface deformation, and in conventional cutting, the effect of subsurface deformation is neglected as the uncut chip thickness is significant. The effect of subsurface deformation should not be neglected as the uncut chip thickness is in the same scale. Subsurface deformed layer is related to the deformation and damage in the material especially in the micro- and nanoscales, in which the size is reduced substantially and the physical characteristics on optics and electricity of the material become different.
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
