Abstract
In this study, titanium (Ti) added Sn58Bi solder alloys were synthesized. Microstructure evolution and mechanical property change during 1008 h thermal aging were compared with those of eutectic Sn58Bi and Ti-added Sn58Bi alloys. According to the results, yield strength (YS) and ultimate tensile strength (UTS) decreased, while even after aging, the Ti-added Sn58Bi alloy maintained the highest YS and UTS. In addition, compared with that of the eutectic Sn58Bi alloy, 0.5 and 1 wt%Ti-added Sn58Bi alloys exhibit a much refined microstructure, before and after aging. The fracture mechanism of eutectic Sn58Bi alloy changed during aging because of the microstructural change, while the fracture morphology of the Ti-bearing Sn58Bi alloys remains almost unchanged.
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