Abstract
AbstractAdherent and coherent deposits of nickel sponge similar to sintered nickel may be made from sulphate, chloride, fluoborate or sulphamate nickel plating solutions containing nickel powder in suspension, providing the concentration of free acid is maintained sufficiently high to inhibit co‐depesition of Ni(OH) In nitrate solution, cathodic reduction of nitrate and deposition of Ni(OH)2 predominates.
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