The electrical and physical properties of CuS– and CdS–polyacrylonitrile composite films prepared by using the organosol method

Abstract

AbstractElectrical and physical properties of the CuS‐ and CdS‐introduced polyacrylonitrile (PAN) films were studied. Electrically conducting PAN film was prepared by introducing CuS and CdS by the organosol method. Electrical surface conductivity of CuS‐ and CdS—PAN composite film prepared by the organosol method was 10−1 and 10−5 S/cm, respectively. Temperature dependence of surface conductivity for CuS—PAN composite film was investigated. The IV characteristics and time dependence of conductivity of samples were observed. The conduction mechanism of CuS– and CdS–PAN composite film was mainly electronic. Electrical properties of the CuS– and CdS—PAN composite film were mainly governed by the CuS and CdS crvstal formed in the PAN film. Temperature dependence of surface conductivity of the heat‐treated CuS—PAN composite film was also investigated. Results show that the electrical properties of the sample were varied slightly according to annealing temperature. Tensile strength and modulus of CuS– and CdS—PAN composite film were slightly decreased than original PAN film, but this decrease was not prevented utilization in electronic devices.