Abstract
Wettability between ribbons of two lead SnAgPb (SAP) and SnPb (SP) solders, and a lead-free SnAgCu (SAC) solder on two Ag paste substrates at temperature ranging from 190 to 280 °C was investigated by the sessile-drop method. The Contact angle (CA) method at high and room temperature was applied to measure the wettability of solder and Ag substrate. For the CA measurement obtained at high temperature, it is generally seen that CA values decreased with increasing soldering temperatures. On the other hand, the CA values of SAP solder were lower than those of SP and SAC solders at 220–240 °C. It is suggested that SAP has a good wettability characteristic, compared to SP and SAC solders, when soldering at 220–240 °C. For the CA measurement obtained at room temperature, the results showed that two lead solders had higher CA values as compared to that of a lead-free SAC solder. Furthermore, the CA values of lead solders were known to increase with increasing soldering temperatures, while SAC solder oppositely decreased with the raising soldering temperatures. In addition, CA values of SAP were detected to be higher at higher temperature than those at RT, suggesting that SAP has dewetting characteristics during the soldering process.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
