Abstract

The ongoing development of microelectromechanical systems (MEMS) over the past decades has made possible the achievement of high-precision micromanipulation within the micromanufacturing, microassembly and biomedical fields. This paper presents different design variants of a horizontal electrothermally actuated MEMS microgripper that are developed as microsystems to micromanipulate and study the deformability properties of human red blood cells (RBCs). The presented microgripper design variants are all based on the U-shape ‘hot and cold arm’ actuator configuration, and are fabricated using the commercially available Multi-User MEMS Processes (MUMPs®) that are produced by MEMSCAP, Inc. (Durham, NC, USA) and that include both surface micromachined (PolyMUMPs™) and silicon-on-insulator (SOIMUMPs™) MEMS fabrication technologies. The studied microgripper design variants have the same in-plane geometry, with their main differences arising from the thickness of the fabricated structures, the consequent air gap separation between the structure and the substrate surface, as well as the intrinsic nature of the silicon material used. These factors are all inherent characteristics of the specific fabrication technologies used. PolyMUMPs™ utilises polycrystalline silicon structures that are composed of two free-standing, independently stackable structural layers, enabling the user to achieve structure thicknesses of 1.5 μm, 2 μm and 3.5 μm, respectively, whereas SOIMUMPs™ utilises a 25 μm thick single crystal silicon structure having only one free-standing structural layer. The microgripper design variants are presented and compared in this work to investigate the effect of their differences on the temperature distribution and the achieved end-effector displacement. These design variants were analytically studied, as well as numerically modelled using finite element analysis where coupled electrothermomechanical simulations were carried out in CoventorWare® (Version 10, Coventor, Inc., Cary, NC, USA). Experimental results for the microgrippers’ actuation under atmospheric pressure were obtained via optical microscopy studies for the PolyMUMPs™ structures, and they were found to be conforming with the predictions of the analytical and numerical models. The focus of this work is to identify which one of the studied design variants best optimises the microgripper’s electrothermomechanical performance in terms of a sufficient lateral tip displacement, minimum out-of-plane displacement at the arm tips and good heat transfer to limit the temperature at the cell gripping zone, as required for the deformability study of RBCs.

Highlights

  • The constantly growing need for high-precision micromanipulation has seen the implementation of microelectromechanical systems (MEMS) in numerous applications within the micromanufacturing and biomedical fields

  • Three microgripper design variants were achieved using the different stackable structural layers offered by the PolyMUMPsTM process, resulting in polysilicon structure thicknesses of 1.5 μm, 2 μm and 3.5 μm

  • The studied microgripper design variants have the same in-plane geometry and their main differences are due to the mechanical structure thickness, the air gap thickness or lack thereof, and the silicon type, all of which are a result of the inherent characteristics of the specific fabrication technology used

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Summary

Introduction

The constantly growing need for high-precision micromanipulation has seen the implementation of microelectromechanical systems (MEMS) in numerous applications within the micromanufacturing and biomedical fields. Our previous work [25] presented an analytical and a numerical model of a horizontal electrothermal microgripper design that were developed to reliably predict the temperature distribution and displacement at the arm tips when operated under atmospheric pressure These developed models focused on an electrothermomechanical analysis which considered heat conduction to the substrate, through both the air gap and the anchor pads, as the main source of heat loss from the structure. The main contribution of the current work consists of utilising the models established and validated in [25] to evaluate and compare the temperature and displacement behaviour of four electrothermal microgripper design variants These microgripper design variants have the same in-plane geometry, with their main differences being the device thickness, the air gap thickness between the structure and the substrate surface, and the intrinsic nature of the silicon material, all of which are characteristics of the fabrication technologies used.

Microgripper Design Variants and Principle of Operation
Fabrication Processes
Numerical Models
Experimental Setup
Results and Discussion
Thermal Analyses
Structural Analyses
Conclusions

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