The Effects of Plasma Treatments and Subsequent Atomic Layer Deposition on the Pore Structure of a k = 2.0 Low-k Material

Abstract

In order to improve the characteristics of future integrated circuits, low dielectric constant (low-k) materials are employed. In this paper we describe in detail the characteristics of k = 2.0, SICOH films treated by capacitively coupled Ar/N2 and Ar/H2 plasmas, which were applied in order to modify the top surface of the film. New insights were obtained about the porous structure of the pristine and the plasma treated films: analyses indicated that the investigated plasma treatments reduced the pore size in the top ten nm of the films, while partial carbon depletion was found down to a few tens of nm inside the film. For the integration of metal barriers deposited by Atomic Layer Deposition in interconnect technologies, precursor penetration into the porous low-k dielectric should be avoided. We investigated precursor penetration in the pores during TaN Atomic Layer Deposition on the pristine and the plasma treated porous low-k films. Detailed analyses showed that the plasma induced modifications resulted in a local growth enhancement and pore sealing during the first cycles of the atomic layer deposition process.