Abstract
In this research, a novel polysaccharide-based bionanocomposite film was prepared via dispersion casting method. Nano-silicon dioxide (SiO2-N) was incorporated into soluble soybean polysaccharide (SSPS) at different concentrations (i.e., 0%, 1%, 3%, and 5% w/w dried SSPS). Mechanical (tensile strength, elongation at break, and Young’s modulus), physical (moisture content, water solubility, and moisture uptake), and barrier properties of bionanocomposite films were evaluated. Incorporation of 5% SiO2-N to SSPS matrix decreased water vapor permeability (WVP) from 7.96×10−11 to 4.75×10−11 g m−1 s−1 Pa−1 and oxygen permeability from 215 to 96 cm3 µm m−2 day−1 atm−1. Heat seal strength and mechanical properties of SSPS films were improved. Moisture sorption isotherm of SSPS films supported by SiO2-N was shifted to lower moisture content, and monolayer moisture content of the films decreased significantly (p<0.05). In summary, SiO2-N is a potential filler in SSPS-based films for packaging materials.
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