The effects of interfacial thermal contact resistance between yarns and matrixes on the thermophysical property of the plain woven C/SiC composite

Abstract

The plain woven C/SiC composites with high thermal shock resistance are widely used in aerospace applications. For this composite, thermal contact resistance (TCR) has an unneglectable contribution to the thermophysical property. In this work, the influence of the TCR on the thermophysical property of a real 2D plain woven C/SiC composite is studied. X-ray CT scanning is used to obtain the microstructures of the C/SiC composite, and the complex structures are restructured and transformed into standard cube grids based on the theory of the intersection of rays and triangles. Combining with finite difference method (FDM) and multiple GPUs acceleration, an efficient approach for numerically predicting the thermophysical property of the real C/SiC composite is established. Based on the Laser Flash Method (LFM) and Differential Scanning Calorimeter (DSC) method, the effective thermal conductivities (ETCs) of the C/SiC composite at different temperatures are obtained experimentally. The results show that ETCs predicted by our numerical method are closer to the measured ones when TCR is considered. Through the numerical simulation and theoretical analysis, the correlation between the ETC and TCR is obtained, which is proved to be a typical Logistic function, and the physical meanings of various constants in the correlation are determined and discussed. Besides, the thermal response time increases with the TCR increasing, simultaneously, the distributions of isotherms and heat-flux trajectories more approach the distributions of fiber yarns in the material.