Abstract
A novel method for preparing epoxy/silver nanocomposites was developed via the in situ formation of silver nanoparticles (AgNPs) within the epoxy resin matrix while using silver nanowires (AgNWs) as a conductive filler. The silver–imidazole complex was synthesized from silver acetate (AgAc) and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole (imidazole). AgNPs were generated in situ during the curing of the epoxy resin through the thermal decomposition of the AgAc–imidazole complex, which was capable of reducing Ag+ to Ag by itself. The released imidazole acted as a catalyst to cure the epoxy. Additionally, after the curing process, the in situ-generated AgNPs were stabilized by the formed epoxy network. Therefore, by using the thermal decomposition method, uniformly dispersed AgNPs of approximately 100 nm were formed in situ in the epoxy matrix filled with AgNWs. It was observed that the nanocomposites containing in situ-formed AgNPs exhibited isotropic electrical properties in the epoxy resins in the presence of AgNWs.
Highlights
Nanocomposite materials containing metal nanoparticles, graphenes, or organoclays dispersed into a polymer matrix exhibit significant absorbing properties because of their novel physical and chemical properties [1–3]
This study investigated various epoxy/silver nanocomposites with and energy-dispersive X-ray spectroscopy (EDX) analysis
This study investigated various different epoxy/silver nanocomposites with different AgNW loading levels
Summary
Nanocomposite materials containing metal nanoparticles, graphenes, or organoclays dispersed into a polymer matrix exhibit significant absorbing properties because of their novel physical and chemical properties [1–3]. Epoxy/metal nanocomposites were used in the field of microelectronic packaging for applications in embedded capacitors and lead-free interconnecting materials [4–7]. One-dimensional nanostructured particles such as nanowires, nanotubes, nanorods, or nanofibers are expected to play an important role in fabricating nanoscale devices and nanocomposites. Metal nanowires such as silver nanowires (AgNWs) were employed as conductive fillers [8–16]. AgNWs have very low electrical resistivity and high thermal conductivity. AgNWs have been primarily used as conductive fillers in conductive adhesive materials. An appropriate distribution of AgNWs within the epoxy network is very important for these applications. AgNWs are thermodynamically unstable and tend to form agglomerates because of their surface activity
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