Abstract
The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag. Then the lead free solder joint material samples were subjected to baking at 150degC for 24 hours, 48 hours, 96 hours and 168 hours. The Dage 4000 series pull test machine was used. Result show that the mean pull strength is 2847.66 g, 2628.20 g and 2613.79 g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare than SANC and SAC387. Hence, three compositions show that joint strength decrease from 24 hours condition to 168 hours at 150degC. In summary pull test method in this research manifestly show the feasibility to be used in characterization of lead free solder joint material for semiconductor or microelectronic packaging.
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