Abstract
With the rapid development of micro electronic component technology, higher requirements are put forward for high performance and high precision manufacturing process. In this paper, copper-nickel alloy micropillars were manufactured by jet electrochemical deposition (Jet ECD) technology with high deposition rate, aiming to provide an effective material and process solution for the manufacture of micro-thermocouples and other components. By optimizing the process parameters such as electrolyte composition, pH value and deposition voltage, the homogeneous deposition of copper-nickel alloy micropillar was realized. The cross-section morphology and elementary composition of the deposition micropillars were characterized in detail by using scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results show that the adjusted formula and process parameters can stably manufacture copper-nickel alloy micropillars with a nickel-copper ratio (close to 0.8), and compact, void free microstructure.
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