The effects of curvature on the thermal conduction of bent silicon nanowire

Abstract

Curvature induced by mechanical deformation in nanostructures has been found to significantly affect their stability and reliability during applications. In this work, we investigated the effects of curvature induced by mechanical bending on the thermal properties of silicon nanowire (SiNW) by using molecular dynamics simulations. By examining the relationship between the curved geometry and local temperature/heat flux distribution, we found that there is no temperature gradient/heat flux along the radial direction of the bent SiNW, and the local heat current density along the circumferential direction varies with the radius of curvature. Interestingly, a ∼10% reduction in the thermal conductivity is found in the bent SiNW due to the depression of long-wavelength phonons caused by its inhomogeneous deformation. The present work demonstrates that the curvature induced by mechanical bending can be used to modulate the thermal conductivity of SiNWs.