Abstract
Polycrystalline CdZnTe films with thickness about 300μm were deposited by close spaced-sublimation (CSS) method. The as-deposited CdZnTe samples were polished by mechanical polishing (MP) process. Cu-doped ZnTe films were sputtered by RF magnetron sputtering as an intermediate layer to improve the performance of Ohmic contact of Au electrodes to CdZnTe films. The effect of Cu-doped ZnTe intermediate layers on the electrical characteristics of Au/CdZnTe and Au/ZnTe:Cu/CdZnTe was investigated by the circular transmission line model (CTLM). The results indicate a good Ohmic contact of Au/ZnTe:Cu/CdZnTe with low contact resistivity of about 0.79Ω·cm2.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
